Shenzhen Biwin Storage Technology Limited

Main Products: SSD, EMMC, SIP, eSSD, MCP

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Company Overview

Founded in 1995 in Shenzhen, China, BIWIN has been devoted to research and application of NAND FLASH. Our products include full-range solid state drives, embedded chips and IC packaging & testing service. With investment in production equipment up to 80 million dollars, we established a 12'' wafer packaging factory in 2009, which is the first one in South China. With 20 years' industry expertise and a strong team, BIWIN develops cutting-edge flash storage products, like 2.5 inch, 1.8 inch, mSATA, M.2, DOM, PCIe SSD, memory cards, eMMC, eMCP, etc, with wide application in consumer, enterprise and industrial field. Wafer Packaging Service -First 12" Wafer Packaging Factory in South China -Include IC Design, Packaging, Testing, Assembling -Wafer Packaging Products:TSOP 48, QFN, BGA, LGA, eMMC, UDP.

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SSD

EMMC

SIP

eSSD

MCP

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Manufacturer

Business Type
2010

Year Established
1,000-3,000 square meters

Factory Size
501 - 1000 People

Total Employees

Company Detail

Transparency is the foundation of our partnership. Below is a comprehensive overview of our operational metrics, from business scale to global market reach, giving you a clear picture of our capabilities.